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| d a t a sh eet product speci?cation supersedes data of 2003 feb 19 2003 oct 14 integrated circuits tja1040 high speed can transceiver
2003 oct 14 2 philips semiconductors product speci?cation high speed can transceiver tja1040 features fully compatible with the iso 11898 standard high speed (up to 1 mbaud) very low-current standby mode with remote wake-up capability via the bus very low electromagnetic emission (eme) differential receiver with high common-mode range for electromagnetic immunity (emi) transceiver in unpowered state disengages from the bus (zero load) input levels compatible with 3.3 v and 5 v devices voltage source for stabilizing the recessive bus level if split termination is used (further improvement of eme) at least 110 nodes can be connected transmit data (txd) dominant time-out function bus pins protected against transients in automotive environments bus pins and pin split short-circuit proof to battery and ground thermally protected. general description the tja1040 is the interface between the controller area network (can) protocol controller and the physical bus. it is primarily intended for high speed applications, up to 1 mbaud, in passenger cars. the device provides differential transmit capability to the bus and differential receive capability to the can controller. the tja1040 is the next step up from the tja1050 high speed can transceiver. being pin compatible and offering the same excellent emc performance, the tja1040 also features: an ideal passive behaviour when supply voltage is off a very low-current standby mode with remote wake-up capability via the bus. this makes the tja1040 an excellent choice in nodes which can be in power-down or standby mode in partially powered networks. quick reference data ordering information symbol parameter conditions min. max. unit v cc supply voltage operating range 4.75 5.25 v i cc supply current standby mode 5 15 m a v canh dc voltage on pin canh 0 < v cc < 5.25 v; no time limit - 27 +40 v v canl dc voltage on pin canl 0 < v cc < 5.25 v; no time limit - 27 +40 v v split dc voltage on pin split 0 < v cc < 5.25 v; no time limit - 27 +40 v v esd electrostatic discharge voltage human body model (hbm) pins canh, canl and split - 6+6kv all other pins - 4+4kv t pd(txd-rxd) propagation delay txd to rxd v stb = 0 v 40 255 ns t vj virtual junction temperature - 40 +150 c type number package name description version tja1040t so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 tja1040u - bare die; die dimensions 1840 1440 380 m m - 2003 oct 14 3 philips semiconductors product speci?cation high speed can transceiver tja1040 block diagram handbook, full pagewidth wake-up mode control driver temperature protection v split canh canl split v cc 5 txd v cc 1 stb 8 rxd 4 3 7 6 wake-up filter time-out & slope mux gnd mgu161 2 tja1040 fig.1 block diagram. pinning symbol pin description txd 1 transmit data input gnd 2 ground supply v cc 3 supply voltage rxd 4 receive data output; reads out data from the bus lines split 5 common-mode stabilization output canl 6 low-level can bus line canh 7 high-level can bus line stb 8 standby mode control input handbook, halfpage mgu160 tja1040t 1 2 3 4 8 7 6 5 stb canh canl split txd gnd v cc rxd fig.2 pin configuration. 2003 oct 14 4 philips semiconductors product speci?cation high speed can transceiver tja1040 functional description operating modes the tja1040 provides two modes of operation which are selectable via pin stb. see table 1 for a description of the modes of operation. table 1 operating modes n ormal mode in this mode the transceiver is able to transmit and receive data via the bus lines canh and canl. see fig.1 for the block diagram. the differential receiver converts the analog data on the bus lines into digital data which is output to pin rxd via the multiplexer (mux). the slope of the output signals on the bus lines is fixed and optimized in a way that lowest electromagnetic emission (eme) is guaranteed. s tandby mode in this mode the transmitter and receiver are switched off, and the low-power differential receiver will monitor the bus lines. a high level on pin stb activates this low-power receiver and the wake-up filter, and after t bus the state of the can bus is reflected on pin rxd. the supply current on v cc is reduced to a minimum in such a way that electromagnetic immunity (emi) is guaranteed and a wake-up event on the bus lines will be recognized. in this mode the bus lines are terminated to ground to reduce the supply current (i cc ) to a minimum. a diode is added in series with the high-side driver of rxd to prevent a reverse current from rxd to v cc in the unpowered state. in normal mode this diode is bypassed. this diode is not bypassed in standby mode to reduce current consumption. split circuit pin split provides a dc stabilized voltage of 0.5v cc .itis turned on only in normal mode. in standby mode pin split is floating. the v split circuit can be used to stabilize the recessive common-mode voltage by connecting pin split to the centre tap of the split termination (see fig.4). in case of a recessive bus voltage <0.5v cc due to the presence of an unsupplied transceiver in the network with a significant leakage current from the bus lines to ground, the split circuit will stabilize this recessive voltage to 0.5v cc . so a start of transmission does not cause a step in the common-mode signal which would lead to poor electromagnetic emission (eme) behaviour. wake-up in the standby mode the bus lines are monitored via a low-power differential comparator. once the low-power differential comparator has detected a dominant bus level for more than t bus , pin rxd will become low. over-temperature detection the output drivers are protected against over-temperature conditions. if the virtual junction temperature exceeds the shutdown junction temperature t j(sd) , the output drivers will be disabled until the virtual junction temperature becomes lower than t j(sd) and txd becomes recessive again. by including the txd condition, the occurrence of output driver oscillation due to temperature drifts is avoided. txd dominant time-out function a txd dominant time-out timer circuit prevents the bus lines from being driven to a permanent dominant state (blocking all network communication) if pin txd is forced permanently low by a hardware and/or software application failure. the timer is triggered by a negative edge on pin txd. if the duration of the low level on pin txd exceeds the internal timer value (t dom ), the transmitter is disabled, driving the bus lines into a recessive state. the timer is reset by a positive edge on pin txd. the txd dominant time-out time t dom defines the minimum possible bit rate of 40 kbaud. fail-safe features pin txd provides a pull-up towards v cc in order to force a recessive level in case pin txd is unsupplied. pin stb provides a pull-up towards v cc in order to force the transceiver into standby mode in case pin stb is unsupplied. in the event that the v cc is lost, pins txd, stb and rxd will become floating to prevent reverse supplying conditions via these pins. mode pin stb pin rxd low high normal low bus dominant bus recessive standby high wake-up request detected no wake-up request detected 2003 oct 14 5 philips semiconductors product speci?cation high speed can transceiver tja1040 limiting values in accordance with the absolute maximum rating system (iec 60134). notes 1. equivalent to discharging a 100 pf capacitor via a 1.5 k w series resistor. 2. equivalent to discharging a 200 pf capacitor via a 0.75 m h series inductor and a 10 w series resistor. 3. junction temperature in accordance with iec 60747-1. an alternative definition of t vj is: t vj =t amb +p r th(vj-amb) , where r th(vj-amb) is a fixed value to be used for the calculating of t vj . the rating for t vj limits the allowable combinations of power dissipation (p) and ambient temperature (t amb ). thermal characteristics in accordance with iec 60747-1. quality specification quality specification in accordance with aec-q100 . symbol parameter conditions min. max. unit v cc supply voltage no time limit - 0.3 +6 v operating range 4.75 5.25 v v txd dc voltage on pin txd - 0.3 v cc + 0.3 v v rxd dc voltage on pin rxd - 0.3 v cc + 0.3 v v stb dc voltage on pins stb - 0.3 v cc + 0.3 v v canh dc voltage on pin canh 0 < v cc < 5.25 v; no time limit - 27 +40 v v canl dc voltage on pin canl 0 < v cc < 5.25 v; no time limit - 27 +40 v v split dc voltage on pin split 0 < v cc < 5.25 v; no time limit - 27 +40 v v trt transient voltages on pins canh, canl and split according to iso 7637; see fig.5 - 200 +200 v v esd electrostatic discharge voltage human body model (hbm); note 1 pins canh and canl and split - 6+6kv all other pins - 4+4kv machine model (mm); note 2 - 200 +200 v t vj virtual junction temperature note 3 - 40 +150 c t stg storage temperature - 55 +150 c symbol parameter conditions value unit r th(vj-a) thermal resistance from virtual junction to ambient in so8 package in free air 145 k/w r th(vj-s) thermal resistance from virtual junction to substrate of bare die in free air 50 k/w 2003 oct 14 6 philips semiconductors product speci?cation high speed can transceiver tja1040 characteristics v cc = 4.75 to 5.25 v, t vj = - 40 to +150 c and r l =60 w unless speci?ed otherwise; all voltages are de?ned with respect to ground; positive currents ?ow into the ic; note 1. symbol parameter conditions min. typ. max. unit supply (pin v cc ) i cc supply current standby mode 5 10 15 m a normal mode recessive; v txd =v cc 2.5 5 10 ma dominant; v txd =0v305070ma transmit data input (pin txd) v ih high-level input voltage 2 - v cc + 0.3 v v il low-level input voltage - 0.3 - +0.8 v i ih high-level input current v txd =v cc - 50 +5 m a i il low-level input current normal mode; v txd =0v - 100 - 200 - 300 m a c i input capacitance not tested - 510pf standby mode control input (pin stb) v ih high-level input voltage 2 - v cc + 0.3 v v il low-level input voltage - 0.3 - +0.8 v i ih high-level input current v stb =v cc - 0 -m a i il low-level input current v stb =0v - 1 - 4 - 10 m a receive data output (pin rxd) v oh high-level output voltage standby mode; i rxd = - 100 m a v cc - 1.1 v cc - 0.7 v cc - 0.4 v i oh high-level output current normal mode; v rxd =v cc - 0.4 v - 0.1 - 0.4 - 1ma i ol low-level output current v rxd = 0.4 v 2 6 12 ma common-mode stabilization output (pin split) v o output voltage normal mode; - 500 m a 2003 oct 14 7 philips semiconductors product speci?cation high speed can transceiver tja1040 note 1. all parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 c ambient temperature for dies on wafer level, and in addition to this 100% tested at 25 c ambient temperature for cased products; unless speci?ed otherwise. for bare dies, all parameters are only guaranteed with the backside of the die connected to ground. v o(reces) recessive output voltage normal mode; v txd =v cc ; no load 2 0.5v cc 3v standby mode; no load - 0.1 0 +0.1 v i o(sc) short-circuit output current v txd =0v pin canh; v canh =0v - 40 - 70 - 95 ma pin canl; v canl = 40 v 40 70 100 ma i o(reces) recessive output current - 27v 2003 oct 14 9 philips semiconductors product speci?cation high speed can transceiver tja1040 handbook, full pagewidth 500 khz 100 nf 47 m f + 5 v 1 nf 1 nf transient generator canl canh mgw336 v cc split rxd tja1040 8 2 gnd stb 15 pf 4 txd 1 3 7 6 5 fig.5 test circuit for automotive transients. the waveforms of the applied transients will be in accordance with iso 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7. handbook, full pagewidth mgs378 v rxd high low hysteresis 0.5 0.9 v i(dif)(bus) (v) fig.6 hysteresis of the receiver. 2003 oct 14 10 philips semiconductors product speci?cation high speed can transceiver tja1040 handbook, full pagewidth 100 nf 47 m f + 5 v mgw335 v cc split rxd tja1040 8 2 gnd stb 15 pf 4 5 txd 1 3 c l 100 pf r l 60 w 7 6 canl canh fig.7 test circuit for timing characteristics. handbook, full pagewidth mgs377 t d(txd-buson) t pd ( txd-rxd ) t pd ( txd-rxd ) 0.3v cc 0.7v cc 0.9 v 0.5 v high low canh txd rxd canl v i(dif)(bus) (1) high recessive (bus off) dominant (bus on) low t d(txd-busoff) t d(buson-rxd) t d(busoff-rxd) fig.8 timing diagram. (1) v i(dif)(bus) =v canh - v canl . 2003 oct 14 11 philips semiconductors product speci?cation high speed can transceiver tja1040 bonding pad locations note 1. all x/y coordinates represent the position of the centre of each pad (in m m) with respect to the left hand bottom corner of the top aluminium layer (see fig.9). symbol pad coordinates (1) xy txd 1 119.5 114.5 gnd 2 648.5 85 v cc 3 1214.25 114.5 rxd 4 1635.25 114.5 split 5 1516.5 1275 canl 6 990.5 1273.75 canh 7 530.25 1273.75 stb 8 113.75 1246 handbook, halfpage mbl584 8 tja1040u 76 5 1 234 y x 0 0 test pad 1 test pad 2 fig.9 bonding pad locations. the backside of the bare die must be connected to ground. 2003 oct 14 12 philips semiconductors product speci?cation high speed can transceiver tja1040 package outline unit a max. a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. 1.0 0.4 sot96-1 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 4 5 pin 1 index 1 8 y 076e03 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.05 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale so8: plastic small outline package; 8 leads; body width 3.9 mm sot96-1 99-12-27 03-02-18 2003 oct 14 13 philips semiconductors product speci?cation high speed can transceiver tja1040 soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: below 220 c (snpb process) or below 245 c (pb-free process) C for all bga and ssop-t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. below 235 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 2003 oct 14 14 philips semiconductors product speci?cation high speed can transceiver tja1040 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 3. these transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the reflow oven. the package body peak temperature must be kept as low as possible. 4. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 6. wave soldering is suitable for lqfp, tqfp and qfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. hot bar or manual soldering is suitable for pmfp packages. revision history package (1) soldering method wave reflow (2) bga, lbga, lfbga, sqfp, ssop-t (3) , tfbga, vfbga not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, hvson, sms not suitable (4) suitable plcc (5) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (5)(6) suitable ssop, tssop, vso, vssop not recommended (7) suitable pmfp (8) not suitable not suitable rev date cpcn description 6 20031014 200307014 product speci?cation (9397 750 11837) modi?cation: change v th(dif) = 0.5 v in standby mode into v dif(th) = 0.4 v add chapter revision history 5 20030219 - product speci?cation (9397 750 10887) 2003 oct 14 15 philips semiconductors product speci?cation high speed can transceiver tja1040 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2003 oct 14 16 philips semiconductors product speci?cation high speed can transceiver tja1040 bare die ? all die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of philips' delivery. if there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. there are no post packing tests performed on individual die or wafer. philips semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. accordingly, philips semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used. ? koninklijke philips electronics n.v. 2003 sca75 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands r16/06/pp 17 date of release: 2003 oct 14 document order number: 9397 750 11837 home a bout nxp news careers investors order/buy support contact my.nxp the tja1040 is the interface between the c ontroller area network (can) protocol cont roller and the physical bus. it is primaril y intended for high speed applications, up to 1 mbaud, in passenger cars. th e device provides differential transmit capability to the bus and differential receive capability to the can controller. the tja1040 is the next step up from the tja1050 high speed ca n transceiver. being pin compatible and offering the same excelle nt emc performance, the tja1040 also features: an ideal passive behaviour when supply voltage is off a very low-current standby mode with re mote wake-upcapability via the bus. this makes the tja1040 an excellent choice in nodes which can be in power-down or standby mode in partially powered networks. fully compatible with the iso 11898 standard high speed (up to 1 mbaud) very low-current standby mode with remote wake-up capability via the bus very low electromagnetic emission (eme) differential receiver with high common-mode range for electromagnetic immunity (emi) transceiver in unpowered state disengages from the bus (zero load) input levels compatible with 3.3 v and 5 v devices voltage source for stabilizing the recessive bus level if split termination is used (further im provement of eme) at least 110 nodes can be connected transmit data (txd) domi nant time-out function bus pins protected against transi ents in automotive environments bus pins and pin split short-circuit proof to battery and ground thermally protected. see the answers to faq's on certain fields of interest find nxp's equivalent of a competitor's part number view case studies on general applications or technologies request contact with a technical expert find more information on nxp's vision find out more about our ordering process receive e-news on specific interest areas datasheet download datasheet download all documentation tja1040 (product specification) 14-oct-03, 17 pages, 91kb tja1040 - high-speed can transceiver with standby mode all information hereunder is subject to the subsequent disclaimers general description features products/packages quality/reliability/chemical content pricing/ordering/availability samples discontinued information applications block diagrams/pinning design support parametrics/similar products print/email disclaimers general descri p tion hide back to top features hide see also preview product information selection guide tja1040 applications looking for products ... transceivers and fail-safe system basis chips high-speed can transceivers tja1040t select site: english type search here search a dvanced search / selection g uides pa g e 1 of 5 tja1040 - hi g h-s p eed can transceiver with standb y mode from nxp semiconductors 21-oc t -2009 http://www.nxp.com / the variants in the table below are discontinued. see the table discontinued information for more information. the variants in the table below are discontinued. see the table discontinued information for more information. quality and reliability disclaimer back to top products/ p acka g es hide type number orderable part num ber ordering code (12nc) product status package packing marking eccn tja1040t/v tja1040t/v,112 9352 853 53112 volume production sot96 tube standard marking tja1040t/v tja1040t/v,118 9352 853 53118 volume production sot96 reel pack, smd, 13" standard marking tja1040t/v tja1040t/v,518 9352 853 53518 volume production sot96 reel dry pack, smd, 13" standard marking tja1040t/vm tja1040t/vm,112 9352 879 61112 volume production sot96 tube standard marking tja1040t/vm tja1040t/vm,118 9352 879 61118 volume production sot96 reel pack, smd, 13" standard marking tja1040t/vm tja1040t/vm,518 9352 879 61518 volume production sot96 reel dry pack, smd, 13" standard marking type number orderable part num ber ordering code (12nc) product status package packing marking eccn tja1040t/n1 tja1040t/n1,112 9352 687 35112 discontinued replacement product sot96 tube standard marking tja1040t/n1 tja1040t/n1,118 9352 687 35118 discontinued replacement product sot96 reel pack, smd, 13" standard marking tja1040t/n1 tja1040t/n1,518 9352 687 35518 discontinued replacement product sot96 reel dry pack, smd, 13" standard marking back to top qualit y /reliabilit y /chemical content hide type number orderable part number chemical content roh s leadfree conversion date rhf ifr (fit) mtbf (hours) msl tja1040t/v tja1040t/v,112 tja1040t_v always pb-free tja1040t/v tja1040t/v,118 tja1040t_v always pb-free tja1040t/v tja1040t/v,518 tja1040t_v always pb-free tja1040t/vm tja1040t/vm,112 tja1040t_vm always pb-free tja1040t/vm tja1040t/vm,118 tja1040t_vm always pb-free tja1040t/vm tja1040t/vm,518 tja1040t_vm always pb-free type number orderable part number chemical content roh s leadfree conversion date rhf ifr (fit) mtbf (hours) msl tja1040t/n1 tja1040t/n1,112 tja1040t_n1 week 3, 2005 tja1040t/n1 tja1040t/n1,118 tja1040t_n1 week 3, 2005 tja1040t/n1 tja1040t/n1,518 tja1040t_n1 always pb-free back to top pa g e 2 of 5 tja1040 - hi g h-s p eed can transceiver with standb y mode from nxp semiconductors 21-oc t -2009 http://www.nxp.com / pricin g /orderin g /availabilit y hide type number ordering code (12nc) orderable part number indicative price/unit ($) region distributor in stock order quantity inventory date buy online samples tja1040t/v 9352 853 53112 tja1040t/v,112 not available tja1040t/v 9352 853 53118 tja1040t/v,118 not available tja1040t/v 9352 853 53518 tja1040t/v,518 not available tja1040t/vm 9352 879 61112 tja1040t/vm,112 not available tja1040t/vm 9352 879 61118 tja1040t/vm,118 not available tja1040t/vm 9352 879 61518 tja1040t/vm,518 not available back to top discontinued information hide type number ordering code (12nc) last-time buy date last-time delivery date replacement product dn notice status comments tja1040t/n1 935268735112 31-dec-09 30-jun-10 tja1040t/vm dn 64 sole source product limited availability (check with your usual sales contact) limited availability. fab icn5 closure. refer to pcn200901054f dated february 12, 2009. replacement type with new diffusion fab location only. tja1040t/n1 935268735118 31-dec-09 30-jun-10 tja1040t/vm dn 64 sole source product limited availability (check with your usual sales contact) limited availability. fab icn5 closure. refer to pcn200901054f dated february 12, 2009. replacement type with new diffusion fab location only. tja1040t/n1 935268735518 31-dec-09 30-jun-10 tja1040t/vm dn 64 sole source product limited availability (check with your usual sales contact) limited availability. fab icn5 closure. refer to pcn200901054f dated february 12, 2009. replacement type with new diffusion fab location only. back to top block dia g rams/ p innin g hide pa g e 3 of 5 tja1040 - hi g h-s p eed can transceiver with standb y mode from nxp semiconductors 21-oc t -2009 http://www.nxp.com / application notes an10211_2;tja1040 high speed can transceiver (2006-11-10) an00094_3;tja1041/1041a high speed can transceiver (2006-11-08) an00020_2;tja1050 high speed can transceiver (2006-11-10) support documents 75015744; high-speed can transceivers tja104x, ja1050 and pca82c25x (2006-09-01) 75016161; nxp automotive networking solutions (2007-09-01) 75015741; the vital link in the interconnected car (2006-09-01) pca82c250_251_tja1040_tja1050; upgrading no te pca82c250/251 -> tja1040, tja1050 (2001-11-20) similar products tja1040 links to the similar products page containing an overview of pr oducts that are similar in function or related to the type numb er(s) as listed on this page. the similar products page includes products from the same catalog tree(s), relevant se lection guides and products from the same functional category. back to top desi g n su pp ort hide back to top parametrics/similar p roducts hide type number package supply voltage (v) application configuration category features function operating temp. (cel) no. of pins package material transceiver type tja1040t/n1 sot96 4.75 ~ 5.25 control devices hs-can transceiver transceiver iso compliant, standby mode, remote wake-up, invisible when off can transceivers -40 ~ +125 8 so8, bare die high speed tja1040t/v sot96 4.75 ~ 5.25 hs-can transceiver transceiver iso compliant, standby mode, remote wake-up, invisible when off -40 ~ +125 8 so8, bare die pa g e 4 of 5 tja1040 - hi g h-s p eed can transceiver with standb y mode from nxp semiconductors 21-oc t -2009 http://www.nxp.com / email this product information print this product information general product disclaimer quality and reliability disclaimer back to top print/email hide back to top disclaimers hide nxp | privacy policy | terms of use | sitemap | switch to classic mode ?2006-2009 nxp semiconductors. all rights reserved. pa g e 5 of 5 tja1040 - hi g h-s p eed can transceiver with standb y mode from nxp semiconductors 21-oc t -2009 http://www.nxp.com / |
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